“QUADSPI device tree configuration”的版本间的差异
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== DT configuration == | == DT configuration == | ||
− | + | 该硬件描述是“''STM32微处理器”''设备树文件(扩展名为.dtsi)和“''板子”设备树文件(扩展名为.dts)的组合。 有关设备树文件分割的说明,请参见[[Device tree]]. | |
− | + | '''STM32CubeMX'''可用于生成板设备树。 有关详细信息,请参阅[[#How_to_configure_the_DT_using_STM32CubeMX|How to configure the DT using STM32CubeMX]] 。 | |
− | '''STM32CubeMX''' | ||
===DT configuration (STM32 level) === | ===DT configuration (STM32 level) === | ||
− | + | QUADSPI外设节点位于``stm32mp157c.dtsi''<ref>{{CodeSource | Linux kernel | arch/arm/boot/dts/stm32mp157c.dtsi}}</ref> 文件。 | |
− | |||
qspi: spi@58003000 { {{highlight|Comments}} | qspi: spi@58003000 { {{highlight|Comments}} | ||
compatible = "st,stm32f469-qspi"; | compatible = "st,stm32f469-qspi"; | ||
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}; | }; | ||
− | {{Warning| | + | {{Warning|与STM32相关的该设备树部分应保持原样,客户不应对其进行修改。}} |
=== DT configuration (board level) === | === DT configuration (board level) === | ||
− | + | QUADSPI外设最多可连接2个SPI-NOR闪存。 | |
− | SPI- | + | SPI-NOR闪存节点<ref name="spi_busses_bindings"/> 必须是QUADSPI外设节点的子级。 |
&qspi { {{highlight|Comments}} | &qspi { {{highlight|Comments}} | ||
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=== DT configuration example === | === DT configuration example === | ||
− | + | 以下示例显示了在连接1个SPI-NAND闪存和1个SPI-NOR闪存时如何配置QUADSPI外设。 | |
&qspi { | &qspi { |
2020年11月10日 (二) 11:47的版本
目录
Article purpose
本文介绍如何在将 QUADSPI internal peripheral 分配给 Linux®操作系统时对其进行配置。 在这种情况下,它由MTD framework控制.
使用device tree 机制执行配置,该机制提供由STM32 QUADSPI Linux驱动程序和MTD框架使用的QUADSPI外围设备的硬件描述。
如果外围设备已分配给另一个执行上下文,请参阅[[[How to assign an internal peripheral to a runtime context]] 文章,了解有关外围设备分配和配置的指南。
DT bindings documentation
QUADSPI设备树绑定由以下组成:
- generic SPI-NOR / SPI-NAND Flash memory bindings [1].
- QUADSPI driver bindings [2].
在接下来的章节中,SPI-NAND绑定只与ecosystem release ≥ v1.1.0{{#set:Ecosystem release=revision of a previous flow 1.1.0}} 兼容。
DT configuration
该硬件描述是“STM32微处理器”设备树文件(扩展名为.dtsi)和“板子”设备树文件(扩展名为.dts)的组合。 有关设备树文件分割的说明,请参见Device tree. STM32CubeMX可用于生成板设备树。 有关详细信息,请参阅How to configure the DT using STM32CubeMX 。
DT configuration (STM32 level)
QUADSPI外设节点位于``stm32mp157c.dtsi[3] 文件。
qspi: spi@58003000 { Comments compatible = "st,stm32f469-qspi"; reg = <0x58003000 0x1000>, --> Register location <0x70000000 0x10000000>; --> Memory mapping address reg-names = "qspi", "qspi_mm"; interrupts = <GIC_SPI 92 IRQ_TYPE_LEVEL_HIGH>; --> The interrupt number used dmas = <&mdma1 22 0x10 0x100002 0x0 0x0 0x0>, --> DMA specifiers [4] <&mdma1 22 0x10 0x100008 0x0 0x0 0x0>; dma-names = "tx", "rx"; clocks = <&rcc QSPI_K>; resets = <&rcc QSPI_R>; status = "disabled"; };
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与STM32相关的该设备树部分应保持原样,客户不应对其进行修改。 |
DT configuration (board level)
QUADSPI外设最多可连接2个SPI-NOR闪存。
SPI-NOR闪存节点[1] 必须是QUADSPI外设节点的子级。
&qspi { Comments pinctrl-names = "default", "sleep"; --> For pinctrl configuration, please refer to Pinctrl device tree configuration pinctrl-0 = <&qspi_clk_pins_a &qspi_bk1_pins_a &qspi_bk2_pins_a>; pinctrl-1 = <&qspi_clk_sleep_pins_a &qspi_bk1_sleep_pins_a &qspi_bk2_sleep_pins_a>; reg = <0x58003000 0x1000>, <0x70000000 0x4000000>; --> Overwrite the memory map to the Flash device size, avoid the waste of virtual memory that will not be used #address-cells = <1>; #size-cells = <0>; status = "okay"; --> Enable the node
flash0: mx66l51235l@0 { compatible = "jdec,spi-nor"; reg = <0>; --> Chip select number spi-rx-bus-width = <4>; --> The bus width (number of data wires used) spi-max-frequency = <108000000>; --> Maximum SPI clocking speed of device in Hz #address-cells = <1>; #size-cells = <1>; }; };
DT configuration example
以下示例显示了在连接1个SPI-NAND闪存和1个SPI-NOR闪存时如何配置QUADSPI外设。
&qspi { pinctrl-names = "default", "sleep"; pinctrl-0 = <&qspi_clk_pins_a &qspi_bk1_pins_a &qspi_bk2_pins_a>; pinctrl-1 = <&qspi_clk_sleep_pins_a &qspi_bk1_sleep_pins_a &qspi_bk2_sleep_pins_a>; reg = <0x58003000 0x1000>, <0x70000000 0x4000000>; #address-cells = <1>; #size-cells = <0>; status = "okay";
flash0: mx66l51235l@0 { compatible = "jdec,spi-nor"; reg = <0>; spi-rx-bus-width = <4>; spi-max-frequency = <108000000>; #address-cells = <1>; #size-cells = <1>; };
flash1: mt29f2g01abagd@1 { compatible = "spi-nand"; reg = <1>; spi-rx-bus-width = <4>; spi-tx-bus-width = <4>; spi-max-frequency = <133000000>; #address-cells = <1>; #size-cells = <1>; }; };
How to configure the DT using STM32CubeMX
The STM32CubeMX tool can be used to configure the STM32MPU device and get the corresponding platform configuration device tree files.
The STM32CubeMX may not support all the properties described in the above DT bindings documentation paragraph. If so, the tool inserts user sections in the generated device tree. These sections can then be edited to add some properties and they are preserved from one generation to another. Refer to STM32CubeMX user manual for further information.
References
Please refer to the following links for full description:
- ↑ 1.01.1 Documentation/devicetree/bindings/spi/spi-bus.txt| |}} Documentation/devicetree/bindings/spi/spi-bus.txt
- ↑ Documentation/devicetree/bindings/spi/spi-stm32-qspi.txt| |}} Documentation/devicetree/bindings/spi/spi-stm32-qspi.txt
- ↑ arch/arm/boot/dts/stm32mp157c.dtsi| |}} arch/arm/boot/dts/stm32mp157c.dtsi
- ↑ Documentation/devicetree/bindings/dma/stm32-mdma.txt| |}} Documentation/devicetree/bindings/dma/stm32-mdma.txt
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